Failure determination of communication led:
Provide fixed current to compare the optical output power. If the error is greater than 10%, it will be judged as invalid.
Mechanical stability test:
Impact test: 5tims/axis, 1500g, 0.5ms vibration test: 20g, 20 ~ 2000Hz, 4min/cycle, 4cycle/axis liquid thermal shock test: 100 ℃ (15sec) ←→ 0 ℃ (5sec) /5cycle solder heat resistance: 260 ℃ /10 seconds /1 time solder adhesion: 250 ℃ /5 seconds
Durability test:
Accelerated aging test: 85 ℃ / power on (maximum rated power) /5000 hours, 10000 hours
High temperature storage: maximum rated storage temperature /2000 hours
Low temperature storage test: maximum rated storage temperature /2000 hours
Temperature cycle test: -40 ℃ (30min) ← 85 ℃ (30min), ramp:10/min, 500cycle
Humidity resistance test: 40 ℃ /95%/56 days, 85 ℃ /85%/2000 hours, when sealing
Screening test of communication diode components:
Temperature screening test: 85 ℃ / power on (maximum rated power) /96 hours screening failure judgment: compare the optical output power with the fixed current, and if the error is greater than 10%, it will be judged as failure
Screening test of communication diode module:
Step 1: temperature cycle screening: -40 ℃ (30min) ←→ 85 ℃ (30min), ramp:10/min, 20cycle, no power supply
Step 2: temperature screening test: 85 ℃ / power on (maximum rated power) /96 hours
